 |
| |||
| high-density integration | |||
| dense device; high-density integrated circuit; highly-packed chip | |||
| high-density IC (элементов) | |||
| ИС с высокой плотностью упаковки: 4 phrases in 2 subjects |
| Microelectronics | 1 |
| Technology | 3 |
|
| |||
| high-density integration | |||
| dense device; high-density integrated circuit; highly-packed chip | |||
| high-density IC (элементов) | |||
| ИС с высокой плотностью упаковки: 4 phrases in 2 subjects |
| Microelectronics | 1 |
| Technology | 3 |