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Subject: kerf analysis Kerf is a measure of the amount of material that is wasted durin machining. Luque(2003) report a typical size for wire saws of 200-250 mm per wafer, which is quite significant when compared to the industry standard wafer thickness of 250-350 mm. This typical wire saw kerf becomes even more impotant for thinner wafers, such as the 100 mm thick silicon wafers.Перевод текста необязателен, подскажите как перевести заголовок данного абзаца правильно (kerf analysis) Благодарю за помощь |
| Раз речь идет о пиле, то я бы перевел заголовок как "Анализ(изучение, исследование) пропила" |
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silicon wafers 100 mm thick? Is it about solar energy? May by microns? |
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