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Subject: mechanical diamond scribing process Здравствуйте! Прошу помощи: сомневаюсь, правильно ли перевела некоторые термины: mechanical diamond scribing process - механический процесс алмазного скрайбирования и diamond slicer - алмазный резак. ( Microfluidic device and method for manufacturing the same). Спасибо.Specifically, the wafer scribing generally adopts a mechanical diamond scribing process, which uses a high-hardness diamond slicer to cut at the scribing lines of a wafer at a high speed to form slice marks. At the same time, a worktable carrying the wafer moves linearly at a certain speed along a tangential direction of a contact point between the diamond slicer and the wafer, so that the wafer can split at the slice marks into individual microfluidic devices.
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